Transmit and Receive Module Engineer

About the role

EDGE, through its joint venture Pulse Nova with Indra, is developing cutting‑edge radar technologies for defense applications. The company seeks an experienced Radar Transmit and Receive Module (TRM) Engineer to lead the design, development, integration, and qualification of high‑performance modules for phased‑array radar systems.

Key responsibilities

• Design and develop transmit/receive modules for phased‑array radar architectures, ensuring compliance with performance specifications.
• Define electrical and functional architectures, covering gain distribution, phase/amplitude control, power amplification, low‑noise reception, switching, and protection.
• Conduct trade‑off analyses on power, efficiency, noise figure, linearity, thermal behavior, reliability, and packaging constraints.
• Coordinate simulation, prototyping, laboratory validation, and environmental qualification across development milestones.
• Collaborate with antenna, RF, mechanical, thermal, power, and manufacturing teams for seamless module integration.
• Lead root‑cause analysis and corrective actions for performance deviations, failures, yield, or reliability issues.
• Support supplier interaction, component evaluation, obsolescence mitigation, and configuration management for critical RF and microwave devices.

Required profile

• Bachelor's or Master's degree in Telecommunications, Electronics, Microwave Engineering or related field.
• 7+ years of RF/microwave design experience, with direct exposure to T/R modules, AESA or phased‑array subsystems.
• Proven ability to lead complex technical workstreams and coordinate multidisciplinary interfaces.
• Prior experience in radar or defense electronics programs is highly desirable.

Required skills

• RF/microwave design and simulation.
• Transmit and receive chain architecture, phase and gain control.
• High‑power amplification, low‑noise design, switching and control interfaces.
• Thermal management, packaging, reliability and manufacturability of high‑frequency modules.
• Laboratory characterization and troubleshooting of integrated microwave assemblies.