Transmit and Receive Module Engineer

About the role

EDGE, through its joint venture Pulse Nova, is seeking an experienced Radar Transmit and Receive Module (TRM) Engineer to lead the design and development of high‑performance modules for phased‑array radar systems. You will be responsible for delivering robust, qualified TRM solutions that meet demanding defense requirements.

Key responsibilities

• Design and develop transmit/receive modules for phased‑array radar architectures, ensuring compliance with system performance targets.
• Define electrical and functional architectures, including gain distribution, phase/amplitude control, power amplification, low‑noise reception, switching, and protection.
• Conduct trade‑off analyses on power, efficiency, noise figure, linearity, thermal behavior, reliability, and packaging constraints.
• Coordinate simulation, prototyping, laboratory validation, and environmental qualification across development milestones.
• Collaborate with antenna, RF, mechanical, thermal, power, and manufacturing teams for seamless module integration.
• Lead root‑cause analysis and corrective actions for performance deviations, failures, yield issues, or reliability concerns.
• Manage supplier interactions, component evaluation, obsolescence mitigation, and configuration management for critical RF and microwave devices.

Required profile

• Bachelor's or Master's degree in Telecommunications, Electronics, Microwave Engineering, or a related field.
• 7+ years of experience in RF/microwave design with direct exposure to T/R modules, AESA architectures, or phased‑array subsystems.
• Proven ability to lead complex technical workstreams and coordinate multidisciplinary interfaces.
• Prior experience in radar or defense electronics programs is highly desirable.

Required skills

• RF and microwave design
• Transmit/Receive (T/R) module development
• AESA and phased‑array radar expertise
• RF simulation and laboratory characterization
• High‑power amplification and low‑noise design
• Thermal management and packaging for high‑frequency modules
• Reliability engineering and manufacturability considerations