Principal Engineer - AI/HPC Fabric Connectivity (Point-to-Point Mapping)

About the role

Dell is looking for a Principal Engineer, Solutions Architecture to develop and maintain detailed point-to-point (P2P) connectivity designs for large-scale AI and HPC network fabrics. You turn approved network architectures, equipment configurations and data centre layouts into accurate, installation-ready port maps and cabling schedules, defining every connection from server NIC to switch port, including patch panels, trunks, cassettes and cross-connects. You work with network architects, infrastructure leads, cabling vendors and deployment teams so that designs are technically correct, physically achievable and fully traceable through installation, validation and handover.

Key responsibilities

• Convert approved AI/HPC network architectures (leaf-spine, Clos, rail-optimized) into installation-ready port maps covering GPU/server NIC to switch port across compute, storage, in-band and OOB fabrics.
• Design the full physical cabling path: patch cords, panels, cassettes, trunks, polarity, breakouts, cable lengths and optical loss budgets, working with Sales teams to validate BOMs.
• Produce and control integration documents: cable schedules, rack elevations, labelling schedules and installation work packs, using automated checks to catch duplicate ports, missing endpoints and incompatible components.
• Support deployment teams and resolve installer queries, working with cabling vendors on compatibility and lead times, and fixing mispatches, polarity faults and failed links.
• Reconcile topology and test results against the design and deliver verified as-built records for handover.

Required profile

• Proven experience producing detailed port maps or structured cabling designs for large data centres, HPC or AI environments.
• Strong knowledge of leaf-spine/Clos and rail-optimized fabrics, plus InfiniBand and high-speed Ethernet at 200/400/800G.
• Hands-on fibre knowledge: SMF/MMF, LC and MPO/MTP, polarity, APC/UPC, cassette mapping, DAC/AOC/optics, loss budgets and test methodologies.
• Able to apply TIA-942/568/606/569 and BICSI 002, and to specify from Corning, Panduit or CommScope portfolios using vendor drawings and part numbers.
• Strong Excel and scripting (e.g. Python) for large connectivity datasets, plus Visio/AutoCAD and disciplined version control.

Desirable

• Experience with NVIDIA Quantum IB/Spectrum-X platforms and topology validation tools such as UFM and LLDP on multi-hall GPU clusters.
• BICSI RCDD/DCDC, a fibre-optic qualification or manufacturer cabling certification.
• Awareness of ISO/IEC and EN standards.